cystech electronics corp. spec. no. : c335n3 issued date : 2009.04.07 revised date : 2014.02.24 page no. : 1/7 bas21/a/c/sn3 cystek product specification high voltage switching (double) diodes bas21/a/c/sn3 description high voltage switching diodes encapsulated in a sot-23 small plastic smd package. single diodes and double diodes with different pinning are available. features ? fast switching speed ? low forward voltage drop ? pb-free lead plating and halogen-free package mechanical data ? case : sot-23, molded plastic ? terminals : solderable per mil-std-202 method 208 ? weight : 0.008 grams(approx.) pinning outline description pin bas21 bas21a bas21c bas21s 1 a k1 a1 a1 2 nc k2 a2 k2 3 k a1,a2 k1,k2 k1,a1 sot-23 1 2 3 (1) bas21 (3)bas21c (2)bas21a (4)bas21s diode configuration and symbol marking: type marking code bas21n3 js bas21an3 js2 bas21cn3 js3 BAS21SN3 js4
cystech electronics corp. spec. no. : c335n3 issued date : 2009.04.07 revised date : 2014.02.24 page no. : 2/7 bas21/a/c/sn3 cystek product specification absolute maximum ratings (ta=25 , unless otherwise specified) parameter symbol limits unit repetitive peak reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 250 v forward continuous current i fm 400 ma average rectified output current i o 200 ma non-repetitive peak forward surge current @ tp=1 s @ tp=100 s @ tp=1s i fsm 9 3 1.7 a repetitive peak forward surge current i frm 625 ma power dissipation p d 250 mw thermal resistance, junction to ambient r t ja 500 q c/w operating junction temperature range t j -65~+150 q c storage temperature range t stg -65~+150 q c characteristics (ta=25 q c) characteristic symbol condition min. max. unit reverse breakdown voltage v br i r =100 a 250 - v i f =100ma - 1 v forward voltage (note) v f i f =200ma - 1.25 v v r =200v - 100 na reverse leakage current i r v r =200v, tj=150 q c - 100 a diode capacitance c d v r =0v, f=1mhz - 5 pf reverse recovery time t rr i f =i r =30ma r l =100 : measured at i r =3ma - 50 ns note : pulse test, tp=300 s, duty cycle<2%. ordering information device package shipping marking bas21n3-0-t1-g js bas21an3-0-t1-g js2 bas21cn3-0-t1-g js3 BAS21SN3-0-t1-g sot-23 (pb-free lead plating and halogen-free package) 3000 pcs / tape & reel js4 environment friendly grade : s for rohs compliant products, g for rohs compliant and green compound products packing spec, t1 : 3000 pcs / tape & reel, 7? reel product rank, zero for no rank products product name
cystech electronics corp. spec. no. : c335n3 issued date : 2009.04.07 revised date : 2014.02.24 page no. : 3/7 bas21/a/c/sn3 cystek product specification typical characteristics forward current vs forward voltage 0.1 1 10 100 1000 0 0.3 0.6 0.9 1.2 1.5 forward voltage---vf(v) instantaneous forward current---if(ma) pulse width=300s 25c 75c 100c 125c 150c reverse leakage current vs reverse voltage 0.001 0.01 0.1 1 10 100 0 50 100 150 200 250 reverse voltage---vr(v) reverse leakage current---ir(a) 100 75 25 125 150c junction capacitance vs reverse voltage 0.1 1 10 0.1 1 10 100 reverse voltage---v r (v) junction capacitance---c j (pf) tj=25, f=1.0mhz power derating curve 0 50 100 150 200 250 0 25 50 75 100 125 150 175 ambient temperature ---t a ( ) power dissipation---p d (mw)
cystech electronics corp. spec. no. : c335n3 issued date : 2009.04.07 revised date : 2014.02.24 page no. : 4/7 bas21/a/c/sn3 cystek product specification typical characteristics(cont.) maximum permissible non-repetitive peak forward surge current 0 1 2 3 4 5 6 7 8 9 10 0.001 0.01 0.1 1 10 pulse duration---tp(ms) peak forward surge current---i fsm (a) recommended soldering footprint
cystech electronics corp. spec. no. : c335n3 issued date : 2009.04.07 revised date : 2014.02.24 page no. : 5/7 bas21/a/c/sn3 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c335n3 issued date : 2009.04.07 revised date : 2014.02.24 page no. : 6/7 bas21/a/c/sn3 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of the package, measured on the package body surface.
cystech electronics corp. spec. no. : c335n3 issued date : 2009.04.07 revised date : 2014.02.24 page no. : 7/7 bas21/a/c/sn3 cystek product specification sot-23 dimension diagram: marking: l4_ xxx 3-lead sot-23 plastic surface mounted package. cystek package code: n3 ? bas21 n3 : single diode (marking code js) ? bas21an3 : common anode. (marking code js2) ? bas21cn3 : common cathode. (marking code js3) ? BAS21SN3 : series connected. (marking code js4) inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.1102 0.1204 2.80 3.04 j 0.0032 0.0079 0.08 0.20 b 0.0472 0.0669 1.20 1.70 k 0. 0118 0.0266 0.30 0.67 c 0.0335 0.0512 0.89 1.30 l 0.0335 0.0453 0.85 1.15 d 0.0118 0.0197 0.30 0.50 s 0.0830 0.1161 2.10 2.95 g 0.0669 0.0910 1.70 2.30 v 0.0098 0.0256 0.25 0.65 h 0.0000 0.0040 0.00 0.10 l1 0. 0118 0.0197 0.30 0.50 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing spec ification or packing method, please cont act your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitab le for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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